IBM, University of Dayton Partner on Future Semiconductor Research

NewsIBM, University of Dayton Partner on Future Semiconductor Research

New Semiconductor Nanofabrication Facility Set to Boost Research and Workforce Development

November 19, 2025

YORKTOWN HEIGHTS, N.Y. and DAYTON, Ohio – A recent collaboration between IBM and the University of Dayton heralds a significant advancement in semiconductor technology and education. This partnership aims to propel the development of next-generation semiconductor technologies and materials, focusing on areas crucial for the AI era, including AI hardware, advanced packaging, and photonics.

IBM, a leading figure in technology and innovation, has announced its intention to provide state-of-the-art semiconductor equipment to the University of Dayton. This contribution will support the creation of a new semiconductor nanofabrication facility located on the university’s campus. Anticipated to be completed by early 2027, this facility will serve as a central hub for advanced semiconductor research and workforce development. It will offer students and researchers at the University of Dayton hands-on, lab-to-fab learning experiences, which means they will have the opportunity to work from laboratory research to practical fabrication.

The partnership is reinforced by the involvement of a dedicated University of Dayton faculty member alongside an IBM Technical Leader. This arrangement provides students and researchers the unique chance to collaborate directly with industry and academic experts, enhancing their educational experience and paving the way for groundbreaking work in semiconductor technology.

Eric F. Spina, President of the University of Dayton, emphasized the significance of this collaboration, noting that it positions the university as a leader in semiconductor research and emerging technology. Spina expressed gratitude for IBM’s substantial equipment contributions, valued at over $10 million, which are expected to play a pivotal role in training the next generation of engineers equipped for the modern economy.

James Kavanaugh, IBM’s Senior Vice President and Chief Financial Officer, highlighted the continued tradition of IBM bringing together industry and academia to drive innovation. He expressed enthusiasm about the opportunities this collaboration presents for students and researchers at the University of Dayton to contribute to the next wave of chip and hardware advancements vital for the AI age.

The agreement builds on a longstanding relationship between IBM and the University of Dayton, who have previously collaborated through the university’s Digital Transformation Center and as members of the AI Alliance, which IBM helped establish in 2023.

This partnership is not just about advancing technology; it is also about cultivating a skilled workforce essential for the long-term success of the U.S. semiconductor industry. Situated in Dayton, Ohio—a city known for its rich history in aviation and home to the Wright-Patterson Air Force Base—this collaboration aims to create a new ecosystem for research and development, with potential impacts at both regional and national levels.

Jeff Hoagland, President and CEO of the Dayton Development Coalition, described the partnership as a transformative opportunity for the Dayton region. He emphasized its potential to significantly enhance semiconductor workforce development and exemplify the collaborative spirit that defines Dayton. Hoagland anticipates positive effects on the community, including strengthening the local tech ecosystem, attracting new businesses, and solidifying Dayton’s reputation as a leading hub for advanced manufacturing and technology.

About IBM

IBM stands as a global leader in hybrid cloud, AI, and consulting expertise, serving clients in over 175 countries. The company helps clients harness insights from their data, streamline business processes, reduce costs, and gain a competitive edge. IBM’s innovations in AI, quantum computing, industry-specific cloud solutions, and consulting deliver open and flexible options to clients, supported by a commitment to trust, transparency, responsibility, inclusivity, and service. For more information, visit IBM’s website.

About the University of Dayton

The University of Dayton is a prominent national, Catholic research university offering programs from undergraduate to doctoral levels. Established in 1850 by the Society of Mary, the university is committed to advancing the common good through intellectual curiosity, academic rigor, and community engagement. Guided by the Marianist educational philosophy, the university emphasizes educating the whole person and linking learning with leadership and service. For more information, visit University of Dayton’s website.

In conclusion, this collaboration between IBM and the University of Dayton is a significant step toward advancing semiconductor technology and education. It offers the University of Dayton a unique position as a leader in this field and provides IBM with a valuable partner in its mission to drive innovation and develop a skilled workforce for the future. The partnership is set to impact not only the immediate region of Dayton but also the broader semiconductor industry in the United States.

For more Information, Refer to this article.

Neil S
Neil S
Neil is a highly qualified Technical Writer with an M.Sc(IT) degree and an impressive range of IT and Support certifications including MCSE, CCNA, ACA(Adobe Certified Associates), and PG Dip (IT). With over 10 years of hands-on experience as an IT support engineer across Windows, Mac, iOS, and Linux Server platforms, Neil possesses the expertise to create comprehensive and user-friendly documentation that simplifies complex technical concepts for a wide audience.
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